Umicore Metal Deposition Solutions ARGUNA® 4500 Fine Silver Electrolyte ARGUNA® 4500 Fine Silver Electrolyte

Description
The new bright silver high-speed electrolyte ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced. The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide. Advantages High-speed electrolyte for the selective deposition of fine silver For reel-to-reel plating using flow or spray technologies Bright coatings with very good soldering and bonding properties Insoluble anodes With little free cyanide Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications
  • ARGUNA® 4500 Fine Silver Electrolyte - ARGUNA® 4500 Fine Silver Electrolyte - Umicore Metal Deposition Solutions
    Umicore Metal Deposition Solutions
Description
The new bright silver high-speed electrolyte ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced. The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide. Advantages High-speed electrolyte for the selective deposition of fine silver For reel-to-reel plating using flow or spray technologies Bright coatings with very good soldering and bonding properties Insoluble anodes With little free cyanide Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

Suppliers

Company
Product
Description
Supplier Links
ARGUNA® 4500 Fine Silver Electrolyte - ARGUNA® 4500 Fine Silver Electrolyte - Umicore Metal Deposition Solutions
Umicore Metal Deposition Solutions
Schwaebisch Gmuend, Germany
ARGUNA® 4500 Fine Silver Electrolyte
ARGUNA® 4500 Fine Silver Electrolyte
ARGUNA® 4500 Fine Silver Electrolyte ARGUNA® 4500 Fine Silver Electrolyte
The new bright silver high-speed electrolyte ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced. The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide. Advantages High-speed electrolyte for the selective deposition of fine silver For reel-to-reel plating using flow or spray technologies Bright coatings with very good soldering and bonding properties Insoluble anodes With little free cyanide Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

The new bright silver high-speed electrolyte

ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties.
ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced.
The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide.

Advantages

  • High-speed electrolyte for the selective deposition of fine silver
  • For reel-to-reel plating using flow or spray technologies
  • Bright coatings with very good soldering and bonding properties
  • Insoluble anodes
  • With little free cyanide

Applications

  • Contact surface for semiconductors and electrical components
  • Leadframe packaging for soldering, bonding and adhesive applications
Supplier's Site
Umicore Materials
Raleigh, NC, USA
ARGUNA® 4500 Fine Silver Electrolyte
ARGUNA® 4500 Fine Silver Electrolyte
ARGUNA® 4500 Fine Silver Electrolyte ARGUNA® 4500 Fine Silver Electrolyte
The new bright silver high-speed electrolyte ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties. ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced. The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide. Advantages High-speed electrolyte for the selective deposition of fine silver For reel-to-reel plating using flow or spray technologies Bright coatings with very good soldering and bonding properties Insoluble anodes With little free cyanide Applications Contact surface for semiconductors and electrical components Leadframe packaging for soldering, bonding and adhesive applications

The new bright silver high-speed electrolyte

ARGUNA® 4500 is a fine silver electrolyte for the fast deposition of ultra-bright coatings with excellent bonding, soldering and adhesive properties.
ARGUNA® 4500 is used for the selective deposition of bright silver layers in reel-to-reel plating using flow and spray technologies such as jet or spot plating modules. Applicable current density and plating speed mainly depend on the electrolyte agitation at the parts, i.e. on the flow velocity in the plant. Under optimum conditions, layers with extreme brightness and reflectance can be produced.
The electrolyte works with insoluble anodes and can be operated with very low concentrations of free cyanide.

Advantages

  • High-speed electrolyte for the selective deposition of fine silver
  • For reel-to-reel plating using flow or spray technologies
  • Bright coatings with very good soldering and bonding properties
  • Insoluble anodes
  • With little free cyanide

Applications

  • Contact surface for semiconductors and electrical components
  • Leadframe packaging for soldering, bonding and adhesive applications

Technical Specifications

  Umicore Metal Deposition Solutions Umicore Materials
Product Category Electrolytes Electrolytes
Product Number ARGUNA® 4500 Fine Silver Electrolyte ARGUNA® 4500 Fine Silver Electrolyte
Product Name ARGUNA® 4500 Fine Silver Electrolyte ARGUNA® 4500 Fine Silver Electrolyte
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