Terra Universal, Inc. F Series Sub ambient Filtered Etch Bath 7018-31

Description
Continuously filters process chemistry to increase purity and maximize product yield Reduced acid consumption generally pays for bath in three months Select semiconductor-grade natural polypropylene or PVDF seamless process tank 360° serrated overflow weir enhances particulate removal Pump/filter assembly is easily removed for quick filter change Uniform flow return system ensures a consistent laminar flow across every wafer at every location—no eddies or dead spots This filtered bath is ideal for oxide etching and other processes using HF acid. Its recirculating system continuously filters the process chemistry to ensure purity and reduce consumption. Depending on 10" (254 mm) filter cartridge selected, these systems provide up to 0.2µ absolute filtration.
Description
Continuously filters process chemistry to increase purity and maximize product yield Reduced acid consumption generally pays for bath in three months Select semiconductor-grade natural polypropylene or PVDF seamless process tank 360° serrated overflow weir enhances particulate removal Pump/filter assembly is easily removed for quick filter change Uniform flow return system ensures a consistent laminar flow across every wafer at every location—no eddies or dead spots This filtered bath is ideal for oxide etching and other processes using HF acid. Its recirculating system continuously filters the process chemistry to ensure purity and reduce consumption. Depending on 10" (254 mm) filter cartridge selected, these systems provide up to 0.2µ absolute filtration.

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F Series Sub ambient Filtered Etch Bath - 7018-31 - Terra Universal, Inc.
Fullerton, CA, USA
F Series Sub ambient Filtered Etch Bath
7018-31
F Series Sub ambient Filtered Etch Bath 7018-31
Continuously filters process chemistry to increase purity and maximize product yield Reduced acid consumption generally pays for bath in three months Select semiconductor-grade natural polypropylene or PVDF seamless process tank 360° serrated overflow weir enhances particulate removal Pump/filter assembly is easily removed for quick filter change Uniform flow return system ensures a consistent laminar flow across every wafer at every location—no eddies or dead spots This filtered bath is ideal for oxide etching and other processes using HF acid. Its recirculating system continuously filters the process chemistry to ensure purity and reduce consumption. Depending on 10" (254 mm) filter cartridge selected, these systems provide up to 0.2µ absolute filtration.
  • Continuously filters process chemistry to increase purity and maximize product yield
  • Reduced acid consumption generally pays for bath in three months
  • Select semiconductor-grade natural polypropylene or PVDF seamless process tank
  • 360° serrated overflow weir enhances particulate removal
  • Pump/filter assembly is easily removed for quick filter change
  • Uniform flow return system ensures a consistent laminar flow across every wafer at every location—no eddies or dead spots

This filtered bath is ideal for oxide etching and other processes using HF acid. Its recirculating system continuously filters the process chemistry to ensure purity and reduce consumption. Depending on 10" (254 mm) filter cartridge selected, these systems provide up to 0.2µ absolute filtration.

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Technical Specifications

  Terra Universal, Inc.
Product Category Semiconductor Wet Process Equipment
Product Number 7018-31
Product Name F Series Sub ambient Filtered Etch Bath
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