Liquid photoimageable solder mask/coverlay for Rigid-Flexible circuit panels
Easily passes industry flexibility testing (10,000x at 180° bending with 1/16 inch mandrel)
Halogen free and RoHS compliant
2 mil resolution capability for today's most advanced technologies
Excellent Copper, FR4 and Polyimide adhesion
Passes UL94 V-0 & NASA outgassing specifications
Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
Colors - Green, Amber, (Other colors are available upon request)
Liquid photoimageable solder mask/coverlay for Rigid-Flexible circuit panels
- Easily passes industry flexibility testing (10,000x at 180° bending with 1/16 inch mandrel)
- Halogen free and RoHS compliant
- 2 mil resolution capability for today's most advanced technologies
- Excellent Copper, FR4 and Polyimide adhesion
- Passes UL94 V-0 & NASA outgassing specifications
- Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
- Colors - Green, Amber, (Other colors are available upon request)
