TE Connectivity Pre-Punched Pc Board; Board Type Entrelec Te Connectivity 17402116

Description
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes
Datasheet
Description
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity - 06WX5661 - Newark, An Avnet Company
Chicago, IL, United States
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity
06WX5661
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity 06WX5661
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes

PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Electronic Development Boards
Product Number 06WX5661
Product Name Pre-Punched Pc Board; Board Type Entrelec Te Connectivity
Category Developement Board
Unlock Full Specs
to access all available technical data

Similar Products

RF, RFID, Wireless Evaluation Boards - EVM-GNSS-GM-ND - DigiKey
Specs
Supported System GPS; Navigation
View Details
2 suppliers
TB,GVA-63+,DF782,50 OHM - TB-410-63+ - Mini-Circuits
Specs
Category Developement Board
View Details
Evaluation Boards - 1EDI303YAS EVALBOARD - Infineon Technologies AG
Specs
Category Developement Board
View Details
Development Tool Accessories - 1311330 - RS Components, Ltd.
Specs
Category Development Suite / Kit
View Details