TE Connectivity Pre-Punched Pc Board; Board Type Entrelec Te Connectivity 17402116

Description
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes
Datasheet
Description
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity - 06WX5661 - Newark, An Avnet Company
Chicago, IL, United States
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity
06WX5661
Pre-Punched Pc Board; Board Type Entrelec Te Connectivity 06WX5661
PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes

PRE-PUNCHED PC BOARD; Board Type:PCB, Pad per Hole; Board Material:Epoxy Glass Composite; Hole Diameter:1.05mm; External Height:45.2mm; External Width:48.3mm; Board Thickness:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Electronic Development Boards
Product Number 06WX5661
Product Name Pre-Punched Pc Board; Board Type Entrelec Te Connectivity
Category Developement Board
Unlock Full Specs
to access all available technical data

Similar Products

Evaluation Boards - BLOCKCHAINSTARTKIT - Infineon Technologies AG
Specs
Category Developement Board
Supported System blockchain applications ; government identification
Host Interface ISO/IEC 14443
View Details
Power, Motor & Robotics Development Tools - 2003856 - RS Components, Ltd.
Specs
Category Development Suite / Kit
View Details