Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Compatible Insulation Diameter Range : 1.07 - 1.85 MM [.042 - .073 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22
Electrical Characteristics Contact Resistance (MOHM) : 12 Insulation Resistance (MEGO) : 5000
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 5000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Wire & Cable
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
- Contact Base Material : Phosphor Bronze
- Contact Current Rating (Max) (AMP) : 5
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
- Contact Orientation : Straight
- Contact Type : Socket
- PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
- Compatible Insulation Diameter Range : 1.07 - 1.85 MM [.042 - .073 INCH ]
- Wire Size (MMSQ) : .12 - .4
- Wire Size (AWG) : 26 - 22
Electrical Characteristics
- Contact Resistance (MOHM) : 12
- Insulation Resistance (MEGO) : 5000
Mechanical Attachment
- PCB Mount Retention : Without
- Wire Insulation Support : With
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Reel
- Packaging Quantity : 5000
Product Type Features
Termination Features
- Product Terminates To : Wire & Cable
Usage Conditions
- Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
