SpeedFam Corporation Polishing Pads

Description
Polishing cover the needs of almost all types of materials to be polished. These pads are suitable for most discriminating prepolish and final polish operations with critical surface requirements. The pads offer finest surface finish when used along with suitable polishing media & its napped poromeric structure helps to produce exact surface finishes. All pads are offered with adhesive backing which simplifies its fixing and removal. Sizes: 305mm to 1400mm diameters Applications: Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.
Description
Polishing cover the needs of almost all types of materials to be polished. These pads are suitable for most discriminating prepolish and final polish operations with critical surface requirements. The pads offer finest surface finish when used along with suitable polishing media & its napped poromeric structure helps to produce exact surface finishes. All pads are offered with adhesive backing which simplifies its fixing and removal. Sizes: 305mm to 1400mm diameters Applications: Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.

Suppliers

Company
Product
Description
Supplier Links
Polishing Pads -  - SpeedFam Corporation
Buffalo Grove, IL, USA
Polishing Pads
Polishing Pads
Polishing cover the needs of almost all types of materials to be polished. These pads are suitable for most discriminating prepolish and final polish operations with critical surface requirements. The pads offer finest surface finish when used along with suitable polishing media & its napped poromeric structure helps to produce exact surface finishes. All pads are offered with adhesive backing which simplifies its fixing and removal. Sizes: 305mm to 1400mm diameters Applications: Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.

Polishing cover the needs of almost all types of materials to be polished. These pads are suitable for most discriminating prepolish and final polish operations with critical surface requirements. The pads offer finest surface finish when used along with suitable polishing media & its napped poromeric structure helps to produce exact surface finishes. All pads are offered with adhesive backing which simplifies its fixing and removal.

Sizes: 305mm to 1400mm diameters

Applications: Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.

Supplier's Site

Technical Specifications

  SpeedFam Corporation
Product Category Laps and Lapping Tools
Product Name Polishing Pads
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