Smiths Interconnect TSX Wire Bondable Fixed Chip Attenuator Series

TSX Wire Bondable Fixed Chip Attenuator Series are small, easy-to-implement, high-reliability product qualified for space and defence applications. The TSX WB2 Series is qualified to MIL-PRF-55342 and designed to offer excellent broadband performance up to 50-GHz, while delivering increased power handling in a small 0404 wire bondable package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership. The new TSX WB2 series can be ordered in group A, B or C testing based on MIL-PRF-55342. Qualification data is included with product delivery for program assurance Features and Benefits Small form factor - Reduces overall footprint Space Qualified – Per MIL-PRF-55342 Wire Bondable – Ideal for chip and wire applications Broad frequency range – Reduces BOM count Low VSWR – Increases transmitted power Wide range of attenuation values – 1-10, 15, 20 and 30dB Tight attenuation tolerance – For optimal performance Applications Amplifier Circuits Transmit/Receive Modules Up/Down Converters Instrumentation Satellite Communications Radar 5G