Smiths Interconnect interposers can be soldered or compression mounted enabling a reduction in manufacturing costs and providing space savings in a confined area. Interposers can be designed to handle substantial amounts of power safely with some individual contacts capable of withstanding as much as 30 Amps in free air. Spring probe technology in custom connectors allows for the integration of mixed signals and functions within a single connector design. This innovative approach enables greater versatility by combining multiple functionalities, such as power, signal, and data transmission, into one compact and efficient solution.
Features & Benefits
Low, stable contact resistance throughout long insertion life
Optimal signal integrity ≥ 40 GHz
Accommodates reduced package size or footprint
Advanced biasing techniques for RF power handling and elevated current carrying capacity
High compliance with 1:3 travel to length ratio
Reliable performance under conditions of heavy shock and vibration without contact interruption
Renowned longevity in the field without sacrificing performance
Advanced materials and plating expertise
Easy, solderless installation and removal
Rapid prototyping capabilities
Spring probe arrays configured to match required footprint
Integrated alignment, latching and sealing features
Smiths Interconnect interposers can be soldered or compression mounted enabling a reduction in manufacturing costs and providing space savings in a confined area. Interposers can be designed to handle substantial amounts of power safely with some individual contacts capable of withstanding as much as 30 Amps in free air. Spring probe technology in custom connectors allows for the integration of mixed signals and functions within a single connector design. This innovative approach enables greater versatility by combining multiple functionalities, such as power, signal, and data transmission, into one compact and efficient solution.
Features & Benefits
- Low, stable contact resistance throughout long insertion life
- Optimal signal integrity ≥ 40 GHz
- Accommodates reduced package size or footprint
- Advanced biasing techniques for RF power handling and elevated current carrying capacity
- High compliance with 1:3 travel to length ratio
- Reliable performance under conditions of heavy shock and vibration without contact interruption
- Renowned longevity in the field without sacrificing performance
- Advanced materials and plating expertise
- Easy, solderless installation and removal
- Rapid prototyping capabilities
- Spring probe arrays configured to match required footprint
- Integrated alignment, latching and sealing features
