LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | TPS31 |
| Product Name | Low-density Thermal Conductive Potting Compound |
| Cure / Technology | Room Temperature Vulcanizing or Curing |
| Type / Form | Grease, Paste; Liquid |
| Chemical System | Silicone |
| Features | Encapsulant, Potting Compound; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive |
