- Trained on our vast library of engineering resources.

Shiu Li Technology Co., Ltd Thermal Conductive Die Attach Adhesive TIM14

Description
LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermal Conductive Die Attach Adhesive - TIM14 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Thermal Conductive Die Attach Adhesive
TIM14
Thermal Conductive Die Attach Adhesive TIM14
LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.

LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.

Supplier's Site

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Adhesives
Product Number TIM14
Product Name Thermal Conductive Die Attach Adhesive
Cure / Technology Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
Industry Electronics
Unlock Full Specs
to access all available technical data

Similar Products

5G mmWave Thermal Conductive Gel Pad - DTT44-s - Shiu Li Technology Co., Ltd
Specs
Type / Form Sheet or Film
Chemical System Silicone
Features Thermally Conductive; UL Rating
View Details
Non-Silicone Thermal Conductive Putty - N-Putty - Shiu Li Technology Co., Ltd
Specs
Features Thermally Conductive
Industry Electronics
Viscosity 15000 cP
View Details
High Insulating Thermal Conductive Film - SH1500/2000/3000 - Shiu Li Technology Co., Ltd
Specs
Type / Form Sheet or Film
Chemical System Silicone
Features Thermally Conductive; UL Rating
View Details
Adhesives, Epoxies, Greases, Pastes - 3153-EP770-1100-ND - DigiKey
Specs
Chemical System Epoxy
Use Temperature -76 to 302 F (-60 to 150 C)
Thermal Conductivity 2.5 W/m-K (1.44 BTU-ft/hr-ft²-F)
View Details