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Shiu Li Technology Co., Ltd Thermal Conductive Gel Pad PK404

Description
LiPOLY’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.
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Thermal Conductive Gel Pad - PK404 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Thermal Conductive Gel Pad
PK404
Thermal Conductive Gel Pad PK404
LiPOLY’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

LiPOLY’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

Supplier's Site Datasheet

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number PK404
Product Name Thermal Conductive Gel Pad
Type / Form Sheet or Film
Chemical System Silicone
Features Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
Industry Electronics
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