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Shiu Li Technology Co., Ltd Thermal Conductive Gel Pad PK223

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Thermal Conductive Gel Pad - PK223 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Thermal Conductive Gel Pad
PK223
Thermal Conductive Gel Pad PK223
LiPOLY’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

LiPOLY’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers customized shape molding service.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number PK223
Product Name Thermal Conductive Gel Pad
Type / Form Sheet or Film
Chemical System Silicone
Features Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
Industry Electronics
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