Non-Silicone Thermal Compound N800A is made of non-silicon resin material and none low-molecular-weight
Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight
Shiu Li Technology Co., Ltd | Shiu Li Technology Co., Ltd | |
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Product Category | Industrial Sealants | Industrial Sealants |
Product Number | N800B | N800B |
Product Name | Non-Silicone Thermal Conductive Pad | Non-Silicone Thermal Conductive Pad |
Type / Form | Sheet or Film | Sheet or Film |
Features | Thermally Conductive | Thermally Conductive |
Industry | Electronics | Electronics |
Gap Fill | 0.0197 to 0.1969 inch (0.5000 to 5 mm) | 0.0197 to 0.1969 inch (0.5000 to 5 mm) |