Shiu Li Technology Co., Ltd Non-Silicone Two-Part Thermal Conductive Sealing Glue EP770

Description
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.
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Non-Silicone Two-Part Thermal Conductive Sealing Glue - EP770 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Non-Silicone Two-Part Thermal Conductive Sealing Glue
EP770
Non-Silicone Two-Part Thermal Conductive Sealing Glue EP770
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.

LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number EP770
Product Name Non-Silicone Two-Part Thermal Conductive Sealing Glue
Chemical System Epoxy
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics
Viscosity 100000 cP
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