- Trained on our vast library of engineering resources.

Shenzhen DeepMaterial Technologies Co., Ltd Conductive Silver Adhesive DM-7110

Description
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Conductive Silver Adhesive - DM-7110 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Conductive Silver Adhesive
DM-7110
Conductive Silver Adhesive DM-7110
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.

Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-7110
Product Name Conductive Silver Adhesive
Cure / Technology Heat curing
Unlock Full Specs
to access all available technical data

Similar Products

Medical Application Translucent UV Curing Adhesive - DM-6657 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Specs
Cure / Technology UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal
View Details
Double-Component Acrylic Structural Adhesive - DM-6751 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Specs
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Acrylic
View Details
UV Moisture Curing Acrylic Acid Adhesive - DM-6492 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Specs
Cure / Technology UV or Radiation Cured; Reactive or Moisture Cured
View Details
UV Thermally Curing Adhesive + heat accelerator - DM-6425 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Specs
Cure / Technology Thermoplastic / Hot Melt; UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal
Industry Electronics
View Details