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Shenzhen DeepMaterial Technologies Co., Ltd Resins And Compounds DM-6258

Description
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
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Resins And Compounds - DM-6258 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Resins And Compounds
DM-6258
Resins And Compounds DM-6258
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

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Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6258
Product Name Resins And Compounds
Cure / Technology Heat Curing
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