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Shenzhen DeepMaterial Technologies Co., Ltd Epoxy Resin DM-6063

Description
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

Suppliers

Company
Product
Description
Supplier Links
Epoxy Resin - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Epoxy Resin
DM-6063
Epoxy Resin DM-6063
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

Supplier's Site
Two-component Epoxy Structural Adhesive - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Two-component Epoxy Structural Adhesive
DM-6063
Two-component Epoxy Structural Adhesive DM-6063
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives Industrial Adhesives
Product Number DM-6063 DM-6063
Product Name Epoxy Resin Two-component Epoxy Structural Adhesive
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing Two Component  ; Reactive or Moisture Cured
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