High volume products that leverage automation and our broad electronic material offering; engineered adhesives, options of dielectric and conductor type.
Capabilities
PET, PEN, PI + film substrates
Functional Adhesives – Flame Retardant, non-Flame Retardant, Thermally conductive, formable, authenticatable.
Screen defined circuitry
Screened Dielectric
Hybrid technology
Roll-to-roll manufacturing, including surface finish
Sheet processing and Circuit Finishing
Cover film/Stiffener Lamination
Shielding Film Application
Screened Shields (Silver)
Electrical Testing
Circuit Blanking
Stiffeners
Folding
Soldering
Crimping
Amp staking
SMT assembly
Copper Surface Finishes
Surface Finishes including:
Electrolytic Tin/Lead
Electroplated Nickel/Gold
Electroless Nickel Immersion Gold (ENIG)
Electroplated Tin
Immersion Silver (ImAg)
High volume products that leverage automation and our broad electronic material offering; engineered adhesives, options of dielectric and conductor type.
Capabilities
- PET, PEN, PI + film substrates
- Functional Adhesives – Flame Retardant, non-Flame Retardant, Thermally conductive, formable, authenticatable.
- Screen defined circuitry
- Screened Dielectric
- Hybrid technology
- Roll-to-roll manufacturing, including surface finish
Sheet processing and Circuit Finishing
- Cover film/Stiffener Lamination
- Shielding Film Application
- Screened Shields (Silver)
- Electrical Testing
- Circuit Blanking
- Stiffeners
- Folding
- Soldering
- Crimping
- Amp staking
- SMT assembly
Copper Surface Finishes
- Surface Finishes including:
- Electrolytic Tin/Lead
- Electroplated Nickel/Gold
- Electroless Nickel Immersion Gold (ENIG)
- Electroplated Tin
- Immersion Silver (ImAg)
