- Trained on our vast library of engineering resources.

Sensata Technologies 890 Series CSP/BGA/QFN Devices

Description
Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has opening for thermal stream or equivalent air-flow temperature control system
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
890 Series CSP/BGA/QFN Devices -  - Sensata Technologies
Attleboro, MA, USA
890 Series CSP/BGA/QFN Devices
890 Series CSP/BGA/QFN Devices
Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has opening for thermal stream or equivalent air-flow temperature control system
  • Lid and adapter molded to allow low cost solutions
  • High force delivery system (up to 40lbf)
  • A variety of contact technologies can be used for this socket ranging from elastomers to spring pins
  • Two finger knob - easy to operate even at high force
  • Lid assembly can be easily removed
  • Lid has opening for thermal stream or equivalent air-flow temperature control system
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 890 Series CSP/BGA/QFN Devices
Product Type IC Socket
Unlock Full Specs
to access all available technical data

Similar Products

656T Series SSOP with Center Pad Connection Devices ZIF -  - Sensata Technologies
Specs
Product Type IC Socket
Contact Resistance 50 milliohms
Operating Temperature 150 C (302 F)
View Details
676 Series TSSOP Devices Dual Pinch ZIF -  - Sensata Technologies
Specs
Product Type IC Socket
Insulation Resistance 12000 Mohms
Contact Resistance 30 milliohms
View Details
676 Series TSSOP Devices Dual Pinch ZIF -  - Sensata Technologies
Specs
Product Type IC Socket
Insulation Resistance 12000 Mohms
Contact Resistance 30 milliohms
View Details