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Sensata Technologies 775E Series CSP/FBGA Devices

Description
0.8mm Pitch Compression surface mount Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition Compact outline and low actuation force achieved through use of innovative latching mechanism Field exchangeable IC guide
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Suppliers

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Product
Description
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775E Series CSP/FBGA Devices -  - Sensata Technologies
Attleboro, MA, USA
775E Series CSP/FBGA Devices
775E Series CSP/FBGA Devices
0.8mm Pitch Compression surface mount Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition Compact outline and low actuation force achieved through use of innovative latching mechanism Field exchangeable IC guide
  • 0.8mm Pitch
  • Compression surface mount
  • Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition
  • Compact outline and low actuation force achieved through use of innovative latching mechanism
  • Field exchangeable IC guide
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 775E Series CSP/FBGA Devices
Product Type IC Socket
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