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Sensata Technologies 72X Series CSP/BGA/QFN Devices Lidded

Description
Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement HTOL Compatible Modular Design: Minimal components Adaptable to various package thickness Any pitch or pitch combination 0.4mm and greater Max I/0 = 250
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Suppliers

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Product
Description
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72X Series CSP/BGA/QFN Devices Lidded -  - Sensata Technologies
Attleboro, MA, USA
72X Series CSP/BGA/QFN Devices Lidded
72X Series CSP/BGA/QFN Devices Lidded
Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement HTOL Compatible Modular Design: Minimal components Adaptable to various package thickness Any pitch or pitch combination 0.4mm and greater Max I/0 = 250
  • Handles package sizes 3x3mm to 10x10mm
  • Clam shell
  • Compression Surface Mount
  • Elastomer interface material
  • Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement
  • HTOL Compatible
  • Modular Design: Minimal components
  • Adaptable to various package thickness
  • Any pitch or pitch combination 0.4mm and greater
  • Max I/0 = 250
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 72X Series CSP/BGA/QFN Devices Lidded
Product Type IC Socket
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