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Sensata Technologies 613 Series Dual In-Line Packages (DIP)

Description
Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe contacts for long, dependable life Excellent component clearance under the socket Four high corner standoffs for easy inspection and cleaning of the PC board For temperatures up to 150°C; for higher temperature applications consult the factory
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613 Series Dual In-Line Packages (DIP) -  - Sensata Technologies
Attleboro, MA, USA
613 Series Dual In-Line Packages (DIP)
613 Series Dual In-Line Packages (DIP)
Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe contacts for long, dependable life Excellent component clearance under the socket Four high corner standoffs for easy inspection and cleaning of the PC board For temperatures up to 150°C; for higher temperature applications consult the factory
  • Compact size for maximum board density
  • Wide target area for easy entry and removal of IC leads
  • Dual face-wipe contacts for long, dependable life
  • Excellent component clearance under the socket
  • Four high corner standoffs for easy inspection and cleaning of the PC board
  • For temperatures up to 150°C; for higher temperature applications consult the factory
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 613 Series Dual In-Line Packages (DIP)
Product Type IC Socket
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