Rego Electronics Inc. Integrated Heat Pipe Assemblies

Integrated Heat Pipe Assemblies solve thermal design issues where space is limited or airflow is not available directly over the heat spot device. Examples of application characteristics include, -Limited Height/space —Heat pipes can spread the cooling solution volume horizontally -Sealed Enclosures— Heat pipes could be used to transport the heat from the device to the wall of the enclosure for heat dissipation and allowing the enclosure to remain sealed. -Obstructed Airflow— Heat pipe allows the condenser to be placed in an area of unobstructed airflow to provide the necessary cooling. Target Market - Industrial Rugged Computing, Server, Storage, Telecommunication Rego offers customization. Please contact us directly!