The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces against ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures. They protect sensitive transmitters and receivers for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode configuration offering snapback ultra low line capacitance of only 0.15 pF. These diodes utilize a snapback structure in order to provide protection to downstream components from ESD voltages up to ±15 kV contact exceeding IEC 61000-4-2, level 4.
Features and benefits
System-level ESD protection for USB 2.0 and USB 3.1 combination, SD card 3.0 and Thunderbolt interfaces
Supports SuperSpeed USB 3.1 at 10 Gbps
Line capacitance of only 0.15 pF for each channel
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±15 kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Design-friendly pass-through signal routing
Applications
The device is designed for high-speed receiver and transmitter port protection:
Portable and wearable devices
Smartphones, tablet computers
TVs and monitors
DVD recorders and players
Notebooks, main board graphic cards and ports
Set-top boxes and game consoles
The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces against ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures. They protect sensitive transmitters and receivers for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode configuration offering snapback ultra low line capacitance of only 0.15 pF. These diodes utilize a snapback structure in order to provide protection to downstream components from ESD voltages up to ±15 kV contact exceeding IEC 61000-4-2, level 4.
Features and benefits
- System-level ESD protection for USB 2.0 and USB 3.1 combination, SD card 3.0 and Thunderbolt interfaces
- Supports SuperSpeed USB 3.1 at 10 Gbps
- Line capacitance of only 0.15 pF for each channel
- All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±15 kV exceeding IEC 61000-4-2, level 4
- Matched 0.5 mm trace spacing
- Design-friendly pass-through signal routing
Applications
The device is designed for high-speed receiver and transmitter port protection:
- Portable and wearable devices
- Smartphones, tablet computers
- TVs and monitors
- DVD recorders and players
- Notebooks, main board graphic cards and ports
- Set-top boxes and game consoles
