Oak-Mitsui Technologies - FaradFlex® FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM MC8M, MC12M and MC24M

Description
These materials are unfilled dielectrics. The thicknesses available include 24, 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies. Applications of MC24-MC8: These products are typically used to lower the impedance (due to low inductance) of the PCB portion of the power distribution network. This allows the removal of most, if not all, decoupling capacitors of 0.1 μF or lower value. The resulting PDN also typically has much lower noise resulting in lower EMI. Decreased PCB thickness and weight are also benefits of implementation. Examples: Servers, Routers, Test Equipment

Suppliers

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FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM - MC8M, MC12M and MC24M - Oak-Mitsui Technologies - FaradFlex®
Hoosick Falls, NY, USA
FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM
MC8M, MC12M and MC24M
FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM MC8M, MC12M and MC24M
These materials are unfilled dielectrics. The thicknesses available include 24, 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies. Applications of MC24-MC8: These products are typically used to lower the impedance (due to low inductance) of the PCB portion of the power distribution network. This allows the removal of most, if not all, decoupling capacitors of 0.1 μF or lower value. The resulting PDN also typically has much lower noise resulting in lower EMI. Decreased PCB thickness and weight are also benefits of implementation. Examples: Servers, Routers, Test Equipment
  • These materials are unfilled dielectrics.
  • The thicknesses available include 24, 12 and 8um.

Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies.

Applications of MC24-MC8:

These products are typically used to lower the impedance (due to low inductance) of the PCB portion of the power distribution network. This allows the removal of most, if not all, decoupling capacitors of 0.1 μF or lower value. The resulting PDN also typically has much lower noise resulting in lower EMI. Decreased PCB thickness and weight are also benefits of implementation.
Examples: Servers, Routers, Test Equipment

Supplier's Site

Technical Specifications

  Oak-Mitsui Technologies - FaradFlex®
Product Category Printed Circuit Substrate Materials (PCB / PWB)
Product Number MC8M, MC12M and MC24M
Product Name FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxM
Features Dielectric / Insulating
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