Mitsui Chemicals America, Inc. ICROS® TAPE

Description
ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this back grinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.
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Description
ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this back grinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.
Request a Quote

Suppliers

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ICROS® TAPE -  - Mitsui Chemicals America, Inc.
White Plains, NY, United States
ICROS® TAPE
ICROS® TAPE
ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this back grinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.

ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this back grinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.

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Technical Specifications

  Mitsui Chemicals America, Inc.
Product Category Printed Circuit Substrate Materials (PCB / PWB)
Product Name ICROS® TAPE
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