Gelest, Inc. TITANIUM TETRAKIS(DIMETHYLAMIDE), 99+% OMTI080

Description
Additional Properties Hydrolytic Sensitivity 8: reacts rapidly with moisture, water, protic solvents Application Catalyzes the preparation of N-heterocycles via C-N bond formation.1 Reference 1. Shen, H.; Xie, Z. J. Am. Chem. Soc. 2010, 132, 11473. Safety Packaging Under Nitrogen ALD Material Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber. Titanium tetrakis(dimethylami de); TDMAT; Tetrakis(dimethylami do)titanium; Tetrakisdimethylamin otitanium Catalyzes the preparation of N-heterocycles via C-N bond formation
Datasheet
Description
Additional Properties Hydrolytic Sensitivity 8: reacts rapidly with moisture, water, protic solvents Application Catalyzes the preparation of N-heterocycles via C-N bond formation.1 Reference 1. Shen, H.; Xie, Z. J. Am. Chem. Soc. 2010, 132, 11473. Safety Packaging Under Nitrogen ALD Material Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber. Titanium tetrakis(dimethylami de); TDMAT; Tetrakis(dimethylami do)titanium; Tetrakisdimethylamin otitanium Catalyzes the preparation of N-heterocycles via C-N bond formation
Datasheet

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TITANIUM TETRAKIS(DIMETHYLAMIDE), 99+% - OMTI080 - Gelest, Inc.
Morrisville, PA, United States
TITANIUM TETRAKIS(DIMETHYLAMIDE), 99+%
OMTI080
TITANIUM TETRAKIS(DIMETHYLAMIDE), 99+% OMTI080
Additional Properties Hydrolytic Sensitivity 8: reacts rapidly with moisture, water, protic solvents Application Catalyzes the preparation of N-heterocycles via C-N bond formation.1 Reference 1. Shen, H.; Xie, Z. J. Am. Chem. Soc. 2010, 132, 11473. Safety Packaging Under Nitrogen ALD Material Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber. Titanium tetrakis(dimethylami de); TDMAT; Tetrakis(dimethylami do)titanium; Tetrakisdimethylamin otitanium Catalyzes the preparation of N-heterocycles via C-N bond formation

Additional Properties


  • Hydrolytic Sensitivity 8: reacts rapidly with moisture, water, protic solvents
    Application
    Catalyzes the preparation of N-heterocycles via C-N bond formation.1
    Reference
    1. Shen, H.; Xie, Z. J. Am. Chem. Soc. 2010, 132, 11473.
    Safety
  • Packaging Under Nitrogen
    ALD Material
    Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.
    Titanium tetrakis(dimethylamide); TDMAT; Tetrakis(dimethylamido)titanium; Tetrakisdimethylaminotitanium
  • Catalyzes the preparation of N-heterocycles via C-N bond formation
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Organic Chemicals
Product Number OMTI080
Product Name TITANIUM TETRAKIS(DIMETHYLAMIDE), 99+%
Chemical Formula C 8 H 2 4 N 4 Ti
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