Micross Components, Inc. MIL-PRF-38534 Screening

MIL-PRF-38534 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot. MIL-PRF-38534 applies to multi-chip modules and systems such as power modules or DC-DC converters. For more information on MIL-PRF-38534 screening and quality conformance inspection, consult the DoD document or contact Micross. MIL-PRF-38534 Screening Requirements Test/Inspection - Screening Level - MIL-STD-883-Method Class H - Class K (Space Level) Pre-Seal Burn-In Optional Optional 1030 Nondestructive Bond Pull N/A 100% 2023 Internal Visual 100% 100% 2017 Temperature Cycle 100% 100% 1010 Constant Acceleration 100% 100% 2001 Mechanical Shock 100% 100% 2002 Particle Impact Noise Detection (PIND) N/A 100% 2020 Preburn-In-Electrica l Optional 100% Burn-In 100% 100% 1015 Final Electrical 100% 100% Seal 100% 100% 1014 Radiographic N/A 100% 2012 External Visual 100% 100% 2009 Micross Hi-Rel Power has also established standard, cost-effective screening programs known as the QIRL and OM803 program. Standard "off the shelf," Space, JANTXV or JANTX level product can be designated as QIRL. These products are fully compliant with all screening and Quality Conformance Inspection (QCI) requirements of MIL-PRF-19500 for Space, JANTXV or JANTX levels. They meet the same data sheet electrical and mechanical specifications, and are produced and tested on a JANS qualified line. The OM803 screening program was developed to offer low-cost screening to our customers while using methods and conditions defined in MIL-STD-750 and MIL-STD-883. The OM803 screening program is performed on all Omnirel standard products. Note 1: Level 2 devices- burn-in time is 48 hours minimum, Level 3 devices - burn-in time is 160 hours minimum. Note 2: PDAs apply to burn-in and post electricals only. Note 3: When ordering "P" level devices, the letter "P" is not marked on the device. Engineering models are designated by the /EM suffix in the part number. Effective as of September 1, 2019, this flow applies to all DC-DC Converter models derived from the following hybrid families: ARA, ARE, AF, ART, GH, GHP, LS, LSO, M3GB, M3N, S, SF, SBB, SBI. EM Screening Flow for DC-DC Converters Part Number Designator - /EM - /CK Compliance Level MIL-PRF-38354 N/A K Level Compliant Screening Requirement MIL-STD-883 TM Temperature Range - Ambient -55°C to +85°C Element Evaluation MIL-PRF-38534 N/A Class K Non-Destructive Bond Pull 2023 N/A Yes Internal Visual 2017 Micross Defined Yes Temperature Cycle 1010 N/A Cond. C Constant Acceleration 2001, Y1 Axis N/A 3000 Gs PIND 2020 N/A Cond. A Burn-In 1015 N/A 320 hrs @ 125°C (2 x 160 hrs) Final-Electrical (Group A) MIL-PRF-38534 & Specification Ambient -55°C, +25°C, +85°C PDA MIL-PRF-38534 N/A 2% Seal, Find and Gross 1014 N/A Cond. CH Radiographic 2012 N/A Yes External Visual 2009 Micross Defined Yes MIL-PRF-38534 Quality Conformance Inspection MIL-PRF-38534 Group A Electrical Testing Sub Group - Parameters - Quantity (Accept Number) 1 Static Tests at +25°C 116 (0) 2 Static Tests at Max. Rated Operating Temp. 76 (0) 3 Static Tests at Min. Rated Operating Temp. 45 (0) 4 Dynamic Tests at 25°C 116 (0) 5 Dynamic Tests at Max. Rated Operating Temp. 15 (0) 6 Dynamic Tests at Min. Rated Operating Temp. 45 (0) 7 Functional Tests at +25°C 116 (0) 8 Functional Tests at Max. & Min. Rated Operating Temp. 76 (0) 9 Switching Tests at +25°C 116 (0) 10 Switching Tests at Max. Rated Operating Temp. 76 (0) 11 Switching Tests at Min. Rated Operating Temp. 45 (0) MIL-PRF-38534 Group B Testing Sub Group - Parameters - Quantity (Accept Number) - Class K - H 1 Physical Dimension 2 (0) X X 2 PIND 15 (0) X 3 Resistance to Solvents 3 (0) X X 4 Internal Visual and Mechanical 1 (0) X X 5 Bond Strength: a. Thermocompression b. Ultrasonic or Wedge c. Flip-Chip d. Beam Lead 2 (0) X X 6 Die-Shear Strength 2 (0) X X 7 Solderability 1 (0) X X 8 Seal: a. Fine b. Gross 15 (0) X 9 ESD: a. Electrical Parameters b. ESDS c. Electrical Parameter 3 (0) X X MIL-PRF-38534 Group C Testing Sub Group - Parameters - Quantity (Accept Number) - Class K - H 1 Physical Dimension 2 (0) X X 2 PIND 15 (0) X 3 Resistance to Solvents 3 (0) X X 4 Internal Visual and Mechanical 1 (0) X X 5 Bond Strength: a. Thermocompression b. Ultrasonic or Wedge c. Flip-Chip d. Beam Lead 2 (0) X X 6 Die-Shear Strength 2 (0) X X 7 Solderability 1 (0) X X 8 Seal: a. Fine b. Gross 15 (0) X 9 ESD: a. Electrical Parameters b. ESDS c. Electrical Parameter 3 (0) X X MIL-PRF-38534 Group D Package Related Testing Sub Group - Parameters - Quantity (Accept Number) 1 Thermal Shock 5 (0) Stabilization Bake 5 (0) Lead Integrity 1 (0) Seal: a. Fine b. Gross 5 (0) 2 Moisture Resistance 5 (0) 3 Salt Atmosphere 5 (0) 4 Metal Package Isolation 3 (0)