Optris Infrared Sensing, LLC Microscope Optics for the Inspection of Electronic Boards

Description
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm (3.15 and 3.94 in). Important specifications Analysis of small chip level components down to 28 μm Hands-free operation for simultaneous testing and IR imaging Exchangeable, focusable lenses for most flexible use of the camera
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Suppliers

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Microscope Optics for the Inspection of Electronic Boards -  - Optris Infrared Sensing, LLC
Portsmouth, NH, United States
Microscope Optics for the Inspection of Electronic Boards
Microscope Optics for the Inspection of Electronic Boards
The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm (3.15 and 3.94 in). Important specifications Analysis of small chip level components down to 28 μm Hands-free operation for simultaneous testing and IR imaging Exchangeable, focusable lenses for most flexible use of the camera

The newly developed Microscope lenses are especially designed for thermal inspection of electronic boards and analyses of small chip level components down to 28 μm. The distance between the measurement object and the camera can vary between 80 and 100 mm (3.15 and 3.94 in).

Important specifications

  • Analysis of small chip level components down to 28 μm
  • Hands-free operation for simultaneous testing and IR imaging
  • Exchangeable, focusable lenses for most flexible use of the camera
Supplier's Site Datasheet

Technical Specifications

  Optris Infrared Sensing, LLC
Product Category Imaging Workstations
Product Name Microscope Optics for the Inspection of Electronic Boards
Applications Electronics or Semiconductor Inspection
Image Source Thermal or Infrared
Feature Resolution 0.0280 mm (0.0011 inch)
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