Master Bond, Inc. High Glass Transition Temperature Epoxy System EP62-1

Description
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of 400 grams is 5-7 hrs. Typical cure conditions range from 4-6 hours at 60°C, 15-25 minutes at 100°C. The cured epoxy resin exhibits remarkably high thermal stability (HDT > 300°F (150 C)) and excellent chemical resistance even when exposed to such aggressive media as 50% sulfuric acid, concentrated ammonium hydroxide, jet fuel, methanol, carbon tetrachloride and methyl ethyl ketone. Shrinkage upon cure is quite low (<0.7%). The cured Master Bond EP62-1 is an excellent electrical insulator. EP62-1 is employed for high performance bonding, filament winding, castings and printed circuit board laminates.
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Description
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of 400 grams is 5-7 hrs. Typical cure conditions range from 4-6 hours at 60°C, 15-25 minutes at 100°C. The cured epoxy resin exhibits remarkably high thermal stability (HDT > 300°F (150 C)) and excellent chemical resistance even when exposed to such aggressive media as 50% sulfuric acid, concentrated ammonium hydroxide, jet fuel, methanol, carbon tetrachloride and methyl ethyl ketone. Shrinkage upon cure is quite low (<0.7%). The cured Master Bond EP62-1 is an excellent electrical insulator. EP62-1 is employed for high performance bonding, filament winding, castings and printed circuit board laminates.
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Suppliers

Company
Product
Description
Supplier Links
High Glass Transition Temperature Epoxy System - EP62-1 - Master Bond, Inc.
Hackensack, NJ, USA
High Glass Transition Temperature Epoxy System
EP62-1
High Glass Transition Temperature Epoxy System EP62-1
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of 400 grams is 5-7 hrs. Typical cure conditions range from 4-6 hours at 60°C, 15-25 minutes at 100°C. The cured epoxy resin exhibits remarkably high thermal stability (HDT > 300°F (150 C)) and excellent chemical resistance even when exposed to such aggressive media as 50% sulfuric acid, concentrated ammonium hydroxide, jet fuel, methanol, carbon tetrachloride and methyl ethyl ketone. Shrinkage upon cure is quite low (<0.7%). The cured Master Bond EP62-1 is an excellent electrical insulator. EP62-1 is employed for high performance bonding, filament winding, castings and printed circuit board laminates.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of 400 grams is 5-7 hrs. Typical cure conditions range from 4-6 hours at 60°C, 15-25 minutes at 100°C. The cured epoxy resin exhibits remarkably high thermal stability (HDT > 300°F (150 C)) and excellent chemical resistance even when exposed to such aggressive media as 50% sulfuric acid, concentrated ammonium hydroxide, jet fuel, methanol, carbon tetrachloride and methyl ethyl ketone. Shrinkage upon cure is quite low (<0.7%). The cured Master Bond EP62-1 is an excellent electrical insulator. EP62-1 is employed for high performance bonding, filament winding, castings and printed circuit board laminates.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP62-1
Product Name High Glass Transition Temperature Epoxy System
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Porous Surfaces
Features Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
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