Master Bond, Inc. Two Component Thermally Conductive Epoxy System EP21TDCANHT

Description
EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexible system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCANHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Finally, EP21TDCANHT offers very high thermal conductivity.
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Description
EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexible system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCANHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Finally, EP21TDCANHT offers very high thermal conductivity.
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Suppliers

Company
Product
Description
Supplier Links
Two Component Thermally Conductive Epoxy System - EP21TDCANHT - Master Bond, Inc.
Hackensack, NJ, USA
Two Component Thermally Conductive Epoxy System
EP21TDCANHT
Two Component Thermally Conductive Epoxy System EP21TDCANHT
EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexible system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCANHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Finally, EP21TDCANHT offers very high thermal conductivity.

EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexible system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCANHT has superior thermal and mechanical shock resistance and is readily thermally cyclable. Finally, EP21TDCANHT offers very high thermal conductivity.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21TDCANHT
Product Name Two Component Thermally Conductive Epoxy System
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy; Polyurethane
Composition Filled
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