- Trained on our vast library of engineering resources.

Master Bond, Inc. NASA Low Outgassing Approved, One Component Epoxy EP17HT-LO

Request a Quote

Suppliers

Company
Product
Description
Supplier Links
NASA Low Outgassing Approved, One Component Epoxy - EP17HT-LO - Master Bond, Inc.
Hackensack, NJ, USA
NASA Low Outgassing Approved, One Component Epoxy
EP17HT-LO
NASA Low Outgassing Approved, One Component Epoxy EP17HT-LO
Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225°C. It has a striking resistance to many chemicals such as acids, bases, salts, fuels, oils and many solvents even at elevated temperatures. Additionally exotherm upon cure is extremely low. This product can be used in castings/encapsulati ons well beyond ½ inch in thickness.

Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225°C. It has a striking resistance to many chemicals such as acids, bases, salts, fuels, oils and many solvents even at elevated temperatures. Additionally exotherm upon cure is extremely low. This product can be used in castings/encapsulations well beyond ½ inch in thickness.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP17HT-LO
Product Name NASA Low Outgassing Approved, One Component Epoxy
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Composition Unfilled
Features High Dielectric; EMI/RFI Shielding; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
Unlock Full Specs
to access all available technical data

Similar Products

High Glass Transition Temperature Epoxy System - EP62-1 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Porous Surfaces
View Details
Low Viscosity, Flexibilized Two Component Epoxy - EP30FL - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life - EP110F8-5 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating - UV10TK40M - Master Bond, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component; UV curing system
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details