Littelfuse, Inc. Surface Mount End-Banded Chip Thermistors 0402 Style (125°C) RA224MOJ

Description
Littelfuse surface mount end-banded thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have a solder coated metallization which is suitable for various contact techniques including wire bond, epoxy or solder. Since they are manufactured using the most advanced equipment and technology available, their dimensional parameters are extremely uniform making the devices especially suitable for use with automatic handling and placement equipment. Features: Surface mountable Small size Low cost Nickel Barrier Options: Non-standard resistance values and tolerances Tape and reel packaging Solder coated metallization Specifications: Thermal time constant: 10 seconds max Dissipation constant: 1 mW/°C Rated to +125°C maximum operating temperature
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Surface Mount End-Banded Chip Thermistors 0402 Style (125°C) - RA224MOJ - Littelfuse, Inc.
Rosemont, IL, United States
Surface Mount End-Banded Chip Thermistors 0402 Style (125°C)
RA224MOJ
Surface Mount End-Banded Chip Thermistors 0402 Style (125°C) RA224MOJ
Littelfuse surface mount end-banded thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have a solder coated metallization which is suitable for various contact techniques including wire bond, epoxy or solder. Since they are manufactured using the most advanced equipment and technology available, their dimensional parameters are extremely uniform making the devices especially suitable for use with automatic handling and placement equipment. Features: Surface mountable Small size Low cost Nickel Barrier Options: Non-standard resistance values and tolerances Tape and reel packaging Solder coated metallization Specifications: Thermal time constant: 10 seconds max Dissipation constant: 1 mW/°C Rated to +125°C maximum operating temperature

Littelfuse surface mount end-banded thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have a solder coated metallization which is suitable for various contact techniques including wire bond, epoxy or solder. Since they are manufactured using the most advanced equipment and technology available, their dimensional parameters are extremely uniform making the devices especially suitable for use with automatic handling and placement equipment. Features: Surface mountable Small size Low cost Nickel Barrier Options: Non-standard resistance values and tolerances Tape and reel packaging Solder coated metallization Specifications: Thermal time constant: 10 seconds max Dissipation constant: 1 mW/°C Rated to +125°C maximum operating temperature

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Thermistors
Product Number RA224MOJ
Product Name Surface Mount End-Banded Chip Thermistors 0402 Style (125°C)
Package / Electrode Type Chip/Surface
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