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Littelfuse, Inc. 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYF30N450

Description
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems
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Suppliers

Company
Product
Description
Supplier Links
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs - IXYF30N450 - Littelfuse, Inc.
Chicago, IL, United States
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs
IXYF30N450
1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs IXYF30N450
Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems

Designed using the proprietary thin-wafer XPT™ technology and state-of-the-art IGBT process, these devices display qualities such as reduced thermal resistance, low tail current, low energy loss, and high-speed switching capability. Thanks to the positive temperature coefficient of their on-state voltage, these high-voltage IGBTs can be used in parallel, which provides cost-effective solutions compared to series-connected, lower-voltage devices. Consequently, this results in reduction in the associated gate drive circuitry, simplicity in design, and improvement in the reliability of the overall system. The optional co-packed fast recovery diodes have low reverse recovery time and are optimized to produce smooth switching waveforms and significantly lower electromagnetic interference (EMI). Features: Thin wafer XPT™ technology Low on-state voltages VCE(sat) Co-packed fast recovery diodes Positive temperature coefficient of VCE(sat) International standard size high-voltage packages Applications: Pulser circuits Laser and X-ray generators High-voltage power supplies High-voltage test equipment Capacitor discharge circuits AC switches Advantages: Higher efficiency Elimination of multiple series-connected devices Increased reliability of power systems

Supplier's Site Datasheet
Transistor, Igbt, 4.5Kv, 23A, Isoplus-I4; Continuous Collector Current Littelfuse - 03AH2019 - Newark, An Avnet Company
Chicago, IL, United States
Transistor, Igbt, 4.5Kv, 23A, Isoplus-I4; Continuous Collector Current Littelfuse
03AH2019
Transistor, Igbt, 4.5Kv, 23A, Isoplus-I4; Continuous Collector Current Littelfuse 03AH2019
TRANSISTOR, IGBT, 4.5KV, 23A, ISOPLUS-I4; Continuous Collector Current:23A; Collector Emitter Saturation Voltage:3.2V; Power Dissipation:230W; Collector Emitter Voltage Max:4.5kV; No. of Pins:3Pins; Operating Temperature Max:150°C RoHS Compliant: Yes

TRANSISTOR, IGBT, 4.5KV, 23A, ISOPLUS-I4; Continuous Collector Current:23A; Collector Emitter Saturation Voltage:3.2V; Power Dissipation:230W; Collector Emitter Voltage Max:4.5kV; No. of Pins:3Pins; Operating Temperature Max:150°C RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc. Newark, An Avnet Company
Product Category Insulated Gate Bipolar Transistors (IGBT) Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYF30N450 03AH2019
Product Name 1700V - 4500V XPT™ (eXtreme-light Punch Through) IGBTs Transistor, Igbt, 4.5Kv, 23A, Isoplus-I4; Continuous Collector Current Littelfuse
VCES 4500 volts
VCE(on) 3.9 volts
IC(max) 23 amps
tf 1220 ns
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