Infineon Technologies AG CoolSiC™ Schottky Diodes IDDD20G65C6

Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650 V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. Summary of Features Offers best-in-class VF and FOM Qc x VF Improved dv/dt ruggedness Easy and effective match with CoolMOS™ 7 SJ MOSFET families Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits Reduced parasitic source inductance improves e iciency and ease-of-use Enables higher power density solutions Exceeding the highest quality standards Benefits Enabling highest energy efficiency Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits Reduced parasitic source inductance improves e iciency and ease-of-use Enables higher power density solutions Exceeding the highest quality standards Potential Applications Telecom Server Solar PC power SMPS Applications 48 V intermediate bus converter (IBC) DIN rail power supplies EV traction inverter Telecommunication infrastructure Uninterruptible power supplies (UPS)