Infineon Technologies AG Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55513 CYW55513

Description
Wi-Fi 6 / 6E Tri-Band Wi-Fi and Bluetooth® / Bluetooth® Low-Energy 5.4 Combo IC The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E wireless standards with many security features and reliable connectivity. This power-efficient design is optimized for smart home, wearables, and other small applications. It offers a cost-effective balance of advanced Wi-Fi 6E and Bluetooth®/BLE features with performance and power savings to meet IoT connectivity needs. Summary of Features 1x1, Tri-Band 2.4/5/6GHz, 20MHz Wi-Fi 6E OFDMA, MU-MIMO, TWT, BSS Coloring, DCM STA and SoftAP mode Network offload power save features WPA2 and WPA3 Security SDIO and GSPI Host Interface Bluetooth®/BLE 5.4 Bluetooth A2DP, HFP Audio, LE Audio LE long range, 2Mbps, Adv. Extensions UART or SDIO shared with Wi-Fi -40 to +85C operating temperature range Secure boot, encryption, authentication Benefits Optimized for IoT applications demands Greenfield 6GHz band for expanded channels Boosts network efficiency Improves range and saves power Bluetooth/BLE Audio hosted or embedded Multi-layer security for more protection Potential Applications Smart home IoT and industrial IoT (IIoT) IP cameras and video door bells Smart door locks Appliances Smart watches Smart glasses Sensors Smart speakers Smart lighting Embedded Edge Wi-Fi 6/6E Podcast
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Suppliers

Company
Product
Description
Supplier Links
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55513 - CYW55513 - Infineon Technologies AG
Neubiberg, Germany
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55513
CYW55513
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55513 CYW55513
Wi-Fi 6 / 6E Tri-Band Wi-Fi and Bluetooth® / Bluetooth® Low-Energy 5.4 Combo IC The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E wireless standards with many security features and reliable connectivity. This power-efficient design is optimized for smart home, wearables, and other small applications. It offers a cost-effective balance of advanced Wi-Fi 6E and Bluetooth®/BLE features with performance and power savings to meet IoT connectivity needs. Summary of Features 1x1, Tri-Band 2.4/5/6GHz, 20MHz Wi-Fi 6E OFDMA, MU-MIMO, TWT, BSS Coloring, DCM STA and SoftAP mode Network offload power save features WPA2 and WPA3 Security SDIO and GSPI Host Interface Bluetooth®/BLE 5.4 Bluetooth A2DP, HFP Audio, LE Audio LE long range, 2Mbps, Adv. Extensions UART or SDIO shared with Wi-Fi -40 to +85C operating temperature range Secure boot, encryption, authentication Benefits Optimized for IoT applications demands Greenfield 6GHz band for expanded channels Boosts network efficiency Improves range and saves power Bluetooth/BLE Audio hosted or embedded Multi-layer security for more protection Potential Applications Smart home IoT and industrial IoT (IIoT) IP cameras and video door bells Smart door locks Appliances Smart watches Smart glasses Sensors Smart speakers Smart lighting Embedded Edge Wi-Fi 6/6E Podcast

Wi-Fi 6 / 6E Tri-Band Wi-Fi and Bluetooth® / Bluetooth® Low-Energy 5.4 Combo IC

The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E wireless standards with many security features and reliable connectivity. This power-efficient design is optimized for smart home, wearables, and other small applications. It offers a cost-effective balance of advanced Wi-Fi 6E and Bluetooth®/BLE features with performance and power savings to meet IoT connectivity needs.


Summary of Features

  • 1x1, Tri-Band 2.4/5/6GHz, 20MHz Wi-Fi 6E
  • OFDMA, MU-MIMO, TWT, BSS Coloring, DCM
  • STA and SoftAP mode
  • Network offload power save features
  • WPA2 and WPA3 Security
  • SDIO and GSPI Host Interface
  • Bluetooth®/BLE 5.4
  • Bluetooth A2DP, HFP Audio, LE Audio
  • LE long range, 2Mbps, Adv. Extensions
  • UART or SDIO shared with Wi-Fi
  • -40 to +85C operating temperature range
  • Secure boot, encryption, authentication

Benefits

  • Optimized for IoT applications demands
  • Greenfield 6GHz band for expanded channels
  • Boosts network efficiency
  • Improves range and saves power
  • Bluetooth/BLE Audio hosted or embedded
  • Multi-layer security for more protection

Potential Applications

  • Smart home
  • IoT and industrial IoT (IIoT)
  • IP cameras and video door bells
  • Smart door locks
  • Appliances
  • Smart watches
  • Smart glasses
  • Sensors
  • Smart speakers
  • Smart lighting

Embedded Edge Wi-Fi 6/6E Podcast

Supplier's Site

Technical Specifications

  Infineon Technologies AG
Product Category Network and Communication Chips
Product Number CYW55513
Product Name Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55513
Technology Bluetooth
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