Indium Corporation Semiconductor Flux Ultra-Low and Near-Zero Residue Flip-Chip Fluxes

Description
Indium Corporation’s Ultra-Low and Near-Zero Residue (ULR/NZR) Flip-Chip Fluxes are halogenfree, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By reducing the residue quantity, the flux allows the flow of capillary or molded underfills (CUF/MUF) without underfill voiding, and its benign chemical nature optimizes the strength of the flux/underfill interface. By eliminating the cleaning process, these fluxes also eliminate the excessive stresses on the die and solder joints caused by every aspect of flux cleaning: jet impingement, ultrasonic and megasonic vibration, air-knife drying, warpage during drying, and unnecessary handling. Features Copper-pillar and standard bump flip-chip dipping Suited for high-tin alloys Ultra-low or near-zero residue levels (ULR/NZR) post-reflow Halogen-free (NIA) No-clean Residues compatible with CUF/MUF

Suppliers

Company
Product
Description
Supplier Links
Indium Corporation’s Ultra-Low and Near-Zero Residue (ULR/NZR) Flip-Chip Fluxes are halogenfree, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By reducing the residue quantity, the flux allows the flow of capillary or molded underfills (CUF/MUF) without underfill voiding, and its benign chemical nature optimizes the strength of the flux/underfill interface. By eliminating the cleaning process, these fluxes also eliminate the excessive stresses on the die and solder joints caused by every aspect of flux cleaning: jet impingement, ultrasonic and megasonic vibration, air-knife drying, warpage during drying, and unnecessary handling. Features Copper-pillar and standard bump flip-chip dipping Suited for high-tin alloys Ultra-low or near-zero residue levels (ULR/NZR) post-reflow Halogen-free (NIA) No-clean Residues compatible with CUF/MUF

Indium Corporation’s Ultra-Low and Near-Zero Residue (ULR/NZR) Flip-Chip Fluxes are halogenfree, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By reducing the residue quantity, the flux allows the flow of capillary or molded underfills (CUF/MUF) without underfill voiding, and its benign chemical nature optimizes the strength of the flux/underfill interface. By eliminating the cleaning process, these fluxes also eliminate the excessive stresses on the die and solder joints caused by every aspect of flux cleaning: jet impingement, ultrasonic and megasonic vibration, air-knife drying, warpage during drying, and unnecessary handling.

Features

  • Copper-pillar and standard bump flip-chip dipping
  • Suited for high-tin alloys
  • Ultra-low or near-zero residue levels (ULR/NZR) post-reflow
  • Halogen-free (NIA)
  • No-clean
  • Residues compatible with CUF/MUF
Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Ultra-Low and Near-Zero Residue Flip-Chip Fluxes
Product Name Semiconductor Flux
Fluxes & Cleaners Soldering Flux / Rosin
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® Powerbond ® Solder Preforms -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
 - 555301 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod
Diameter / Thickness 0.0276 inch (0.7000 mm)
Melting Range 423 F (217 C)
View Details
Starter Kit with Cast Iron Rods and Cast Iron Flux -  - Detroit Torch & Mfg. Co.
Specs
Joining Process / Product Form Powder; Rod
Welding Filler Types Cast Iron
Weld Positions All positions
View Details
Hard Surfacing Alloy - Universal Cobalt Alloy No.21 - Universal Wire Works Inc.
Specs
Joining Process / Product Form Solid wire or rod
Diameter / Thickness 0.0450 to 0.1560 inch (1.14 to 3.96 mm)
Nominal Composition 1.65C-28.5Cr-2Fe-1Mo-2Ni-1Si-8.5W-BalanceCo
View Details