Indium Corporation Semiconductor Flux Flip-Chip Flux NC-826

Description
Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless packaging Low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-826 is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Flux - Flip-Chip Flux NC-826 - Indium Corporation
Clinton, NY, USA
Semiconductor Flux
Flip-Chip Flux NC-826
Semiconductor Flux Flip-Chip Flux NC-826
Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless packaging Low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-826 is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

Features

  • Designed for copper-pillar flip-chip dipping applications
  • Tackiness suitable for holding multicore die during assembly
  • Compatible with underfills
  • No wetting onto die surface
  • Dipping with minimal bridging
  • Bubble-free airless packaging
  • Low residue
  • Halogen-free
  • No-clean

Introduction

Flip-Chip Flux NC-826 is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Flip-Chip Flux NC-826
Product Name Semiconductor Flux
Fluxes & Cleaners Soldering Flux / Rosin
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® Stencils Accessories -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
 - 4203095 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod
Diameter / Thickness 0.0394 inch (1 mm)
Melting Range 423 F (217 C)
View Details
Cast Iron Flux 4 oz. -  - Detroit Torch & Mfg. Co.
Detroit Torch & Mfg. Co.
Specs
Joining Process / Product Form Powder
Welding Filler Types Cast Iron
Weld Positions All positions
View Details
Aerospace Alloy - AMS 5689 - Universal Wire Works Inc.
Universal Wire Works Inc.
Specs
Joining Process / Product Form TIG Rod (GTAW); MIG Spool (GMAW)
Diameter / Thickness 0.0200 to 0.1250 inch (0.5080 to 3.17 mm)
Nominal Composition .08C-18Cr-.5Cu-2Mn-.75Mo-11Ni-.04P-.03S-1Si-6Ti
View Details