Indium Corporation Semiconductor Flux Ball-Attach Flux NC-585

Description
Features Halogen-free, no-clean residue Suitable for pin-grid array and standard ball-grid array applications Airless packaging Excellent solderability to all common surface metallizations Can be used for printing, dipping, pin transfer deposition Offers high yields and PGA bumping process Suitable for both Pb-Free or Sn/Pb applications Introduction Ball Attach Flux NC-585 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA and PGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods.
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Semiconductor Flux - Ball-Attach Flux NC-585 - Indium Corporation
Clinton, NY, USA
Semiconductor Flux
Ball-Attach Flux NC-585
Semiconductor Flux Ball-Attach Flux NC-585
Features Halogen-free, no-clean residue Suitable for pin-grid array and standard ball-grid array applications Airless packaging Excellent solderability to all common surface metallizations Can be used for printing, dipping, pin transfer deposition Offers high yields and PGA bumping process Suitable for both Pb-Free or Sn/Pb applications Introduction Ball Attach Flux NC-585 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA and PGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods.

Features

  • Halogen-free, no-clean residue
  • Suitable for pin-grid array and standard ball-grid array applications
  • Airless packaging
  • Excellent solderability to all common surface metallizations
  • Can be used for printing, dipping, pin transfer deposition
  • Offers high yields and PGA bumping process
  • Suitable for both Pb-Free or Sn/Pb applications

Introduction

Ball Attach Flux NC-585 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA and PGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods.

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Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Ball-Attach Flux NC-585
Product Name Semiconductor Flux
Fluxes & Cleaners Soldering Flux / Rosin
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