Hernon Manufacturing, Inc. Formulations - Applications - Bonding - React 784 378425

ReAct® 784 has excellent bond strength as a structural adhesive. This formulation will offer rapid, high strength and high impact resistant bonds to a variety of substrates within minutes. Designed for a wide variety of substrates. ReAct® 784 is a room temperature curing adhesive, used in combination with Activator 15. This no-mix system allows controlled assembly ideal for production and repair applications. A structural bond develops within minutes.