Dissipator 745 is a thermally conductive adhesive designed for bonding electrical components to heat sinks while maintaining a controlled gap. It cures at room temperature and features a unique shimming property that creates a consistent gap of 0.005 to 0.006 inches between components, ensuring electrical insulation alongside thermal conductivity. The product is classified as hazardous, with potential skin and eye irritation, and requires appropriate personal protective equipment during handling. It contains several chemical components, including aluminum hydroxide and cumene hydroperoxide, and is compliant with various international inventories. Engineers should consider the safety precautions and handling requirements when integrating this adhesive into their projects.
Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
| Hernon Manufacturing, Inc. | |
|---|---|
| Product Category | Thermal Compounds and Thermal Interface Materials |
| Product Number | 374552 |
| Product Name | Formulations - Applications - Thermally Conductive - Dissipator 745 |
| Cure / Technology | Room Temperature Vulcanizing or Curing |
