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Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 313 3313A35

Description
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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Suppliers

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Product
Description
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Formulations - Applications - Bonding - Tuffbond 313 - 3313A35 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 313
3313A35
Formulations - Applications - Bonding - Tuffbond 313 3313A35
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3313A35
Product Name Formulations - Applications - Bonding - Tuffbond 313
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
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