LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering
LOCTITE® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water in 5 to 15 minutes at 40°C to 60°C.
Options and Configurations
Alloy: 63S4, Sn63
Particle Size: Type 3, 3C, 4
Water washable, tin-lead solder paste
Halogen-free flux passes IPC-TM-650 2.3.34/EN14582, flux class '0', J-STD004B ORM0
Suitable for fine pitch, high speed printing
Excellent resistance to hot slump @ 150°C
Good humidity resistance to solder balling
Excellent solderability in air
Available with anti-tombstoning alloy technology for improved resistance to tombstone defects
Residues designed for easy removal when cleaned with deionized water
LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering
LOCTITE® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water in 5 to 15 minutes at 40°C to 60°C.
Options and Configurations
- Alloy: 63S4, Sn63
- Particle Size: Type 3, 3C, 4
- Water washable, tin-lead solder paste
- Halogen-free flux passes IPC-TM-650 2.3.34/EN14582, flux class '0', J-STD004B ORM0
- Suitable for fine pitch, high speed printing
- Excellent resistance to hot slump @ 150°C
- Good humidity resistance to solder balling
- Excellent solderability in air
- Available with anti-tombstoning alloy technology for improved resistance to tombstone defects
- Residues designed for easy removal when cleaned with deionized water
