Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation
| Henkel Corporation - Electronics | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Name | LOCTITE DA 100 |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
