Hamamatsu Photonics Europe GmbH InGaAs image sensors, Area sensors G13544-01

Image sensor with 192 × 96 pixels developed for two-dimensional infrared imaging The G13544-01 has a hybrid structure consisting of a CMOS readout circuit (ROIC: readout integrated circuit) and back-illumi-nated InGaAs photodiodes. Each pixel is made up of an InGaAs photodiode and a ROIC electrically connected by indium bump. The timing generator in the ROIC provides an analog video output and AD-TRIG output which are obtained by just supplying digital inputs.The G13544-01 has 192 × 96 pixels arrayed at a 50 μm pitch. Light incident on the InGaAs photodiodes is converted into elec-trical signals which are then input to the ROIC through indium bumps. Electrical signals in the ROIC are converted into voltage signals and then sequentially output from the video line by the shift register. The G13544-01 is hermetically sealed in a metal package together with a two-stage thermoelectric cooler to deliver stable operation.