Harwin Plc Circular SMT Contact Pad, Ø3.20mm, 0.2mm thick (T+R) S70-332002045R

Harwin Plc
Win Source Electronics

Description

Surface Mount flat contact pad, circular shape. Gold finish. Ø3.2mm, 0.2mm thick. Use as a hard-wearing mating surface for SMT Spring Contacts, Spring Loaded Contacts and Spring Loaded Contact Assemblies.

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Harwin Plc

Portsmouth, United Kingdom

Circular SMT Contact Pad, Ø3.20mm, 0.2mm thick (T+R)
S70-332002045R

Circular SMT Contact Pad, Ø3.20mm, 0.2mm thick (T+R) S70-332002045R

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Datasheet

Win Source Electronics

Yishun, Singapore

Connectors, Interconnects -Contacts- Contacts, Spring Loaded (Pogo Pins), and Pressure
S70-332002045R

Connectors, Interconnects -Contacts- Contacts, Spring Loaded (Pogo Pins), and Pressure S70-332002045R

Manufacturer: Harwin Inc. Category: Connectors, Interconnects -Contacts- Contacts, Spring Loaded (Pogo Pins), and Pressure Package: Tape & Reel (TR) Cut Tape (CT) Product Status: Active Contact Type: Contact Pad Mounting Type: Surface Mount Pad Layout Dimension: Circular - 0.126" (3.20mm) Dia, 0.008" (0.20mm) H Contact Material: Beryllium Copper Contact Finish: Gold Contact Finish Thickness: Flash

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Technical Specifications

	Harwin Plc	Win Source Electronics
Product Category	Electrical Contacts	Electrical Contacts
Product Number	S70-332002045R	S70-332002045R
Product Name	Circular SMT Contact Pad, Ø3.20mm, 0.2mm thick (T+R)	Connectors, Interconnects -Contacts- Contacts, Spring Loaded (Pogo Pins), and Pressure
Shape / Form	Circular shape	Stamping
Features	RoHS Compliant (2015/863/EU) with no Exemption required
Contact Material	Gold or Gold Alloy	Cu; Beryllium Copper