DESCRIPTION:
G6E-P™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials
. G6E-P™ is formulated with proprietary nanomaterials and fillers. G6E-P™ epoxy can be cured at room temperature. A heating oven is suggested for faster curing times. G6E-P™ epoxy is low cost as to compared to the silver epoxy. Uses for G6E-P™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.
FEATURES:
· Carbon Filled (Non-Metallic & Non-Magnetic)
· Low Cost
· Low Density
· Electrically Conductive
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Photovoltaic (Solar) Cells
· Casting, Coating & Encapsulation
· EMI / RFI Shielding
· Display Packaging / Bonding
· Temperature Sensitive Electronics
· Medical Devices / Sensors
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM: Part A – smooth thick black paste
Part B – black liquid
MIX RATIO: 100 (Part A) to 32 (Part B) by weight.
POT LIFE: 2 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:
24 hours @ 25°C / 77°F
5 hours @ 80°C / 176°F
2 hours @ 120°C / 248°F
DENSITY: Part A 1.0 – 1.1 g/cm3
Part B 1.0 – 1.1 g/cm3
MIXED VISCOSITY: 145 to 155 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 73°C / 163°F
HARDNESS, SHORE: >80 D
VOLUME RESISTIVITY: ~5 ω·cm
DESCRIPTION:
G6E-P™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P™ is formulated with proprietary nanomaterials and fillers. G6E-P™ epoxy can be cured at room temperature. A heating oven is suggested for faster curing times. G6E-P™ epoxy is low cost as to compared to the silver epoxy. Uses for G6E-P™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.
FEATURES:
· Carbon Filled (Non-Metallic & Non-Magnetic)
· Low Cost
· Low Density
· Electrically Conductive
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Photovoltaic (Solar) Cells
· Casting, Coating & Encapsulation
· EMI / RFI Shielding
· Display Packaging / Bonding
· Temperature Sensitive Electronics
· Medical Devices / Sensors
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM: Part A – smooth thick black paste
Part B – black liquid
MIX RATIO: 100 (Part A) to 32 (Part B) by weight.
POT LIFE: 2 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:
24 hours @ 25°C / 77°F
5 hours @ 80°C / 176°F
2 hours @ 120°C / 248°F
DENSITY: Part A 1.0 – 1.1 g/cm3
Part B 1.0 – 1.1 g/cm3
MIXED VISCOSITY: 145 to 155 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 73°C / 163°F
HARDNESS, SHORE: >80 D
VOLUME RESISTIVITY: ~5 Ω·cm
