DESCRIPTION:
G6E-NS10™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10™ has been developed based on advanced proprietary technology that requires 25% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS10™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is strongly recommended for curing. Uses for G6E-NS10™ epoxy include electronic circuits, EMI / RFI shielding assembly and repair, etc.
FEATURES:
· Silver-Carbon Filled (Non-Magnetic)
· Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
TYPICAL APPLICATIONS:
· PCB Manufacture / Repair
· EMI / RFI Shielding
· Display Packaging / Bonding
· Electronics Manufacture / Repair
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 60 hours @ 25°C / 77°F
3 hours @ 70°C / 158°F
1 hour @ 150°C / 302°F
DENSITY: Part A 2.0 – 2.15 g/cm3
Part B 2.0 – 2.15 g/cm3
MIXED VISCOSITY: 150 to 155 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 103°C / 217°F cured at 150°C / 302°F
HARDNESS, SHORE: >60 D
VOLUME RESISTIVITY: 0.005 ω·cm
DESCRIPTION:
G6E-NS10™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10™ has been developed based on advanced proprietary technology that requires 25% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS10™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is strongly recommended for curing. Uses for G6E-NS10™ epoxy include electronic circuits, EMI / RFI shielding assembly and repair, etc.
FEATURES:
· Silver-Carbon Filled (Non-Magnetic)
· Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
TYPICAL APPLICATIONS:
· PCB Manufacture / Repair
· EMI / RFI Shielding
· Display Packaging / Bonding
· Electronics Manufacture / Repair
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 60 hours @ 25°C / 77°F
3 hours @ 70°C / 158°F
1 hour @ 150°C / 302°F
DENSITY: Part A 2.0 – 2.15 g/cm3
Part B 2.0 – 2.15 g/cm3
MIXED VISCOSITY: 150 to 155 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 103°C / 217°F cured at 150°C / 302°F
HARDNESS, SHORE: >60 D
VOLUME RESISTIVITY: 0.005 Ω·cm
