DESCRIPTION:
G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical resistivity. Graphene fillers add superior durability, fatigue and crack resistance along with low electrical resistance. A heating oven is strongly recommended for curing. Uses for G6E-FXSG™ epoxy include flexible circuits, medical sensor assembly and repair, etc.
FEATURES:
· Flexible (after curing)
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Resistant to Temperature Variations
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Wearable Electronics
· Medical Sensors
· Fiber-Optics Packaging
· Flexible Electronics, Wiring & Harnesses
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic silver paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 1 hour
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:
24 hours @ 25°C / 77°F or
3 hours @ 60°C / 140°F followed by 30 minutes
@ 60°C / 140°F to 160°C / 320°F or
1 to 2 hours @ 60°C / 140°F to 160°C / 320°F
DENSITY: Part A 3.1 – 3.2 g/cm3
Part B 3.0 – 3.2 g/cm3
MIXED VISCOSITY: 110 to 125 Pa·s @ 25°C / 77°F
GLASS TRANSITION
TEMPERATURE (Tg): 39°C / 102°F
HARDNESS, SHORE: >40 D
VOLUME RESISTIVITY: 0.0005 ω·cm
DESCRIPTION:
G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical resistivity. Graphene fillers add superior durability, fatigue and crack resistance along with low electrical resistance. A heating oven is strongly recommended for curing. Uses for G6E-FXSG™ epoxy include flexible circuits, medical sensor assembly and repair, etc.
FEATURES:
· Flexible (after curing)
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Resistant to Temperature Variations
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Wearable Electronics
· Medical Sensors
· Fiber-Optics Packaging
· Flexible Electronics, Wiring & Harnesses
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic silver paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 1 hour
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:
24 hours @ 25°C / 77°F or
3 hours @ 60°C / 140°F followed by 30 minutes
@ 60°C / 140°F to 160°C / 320°F or
1 to 2 hours @ 60°C / 140°F to 160°C / 320°F
DENSITY: Part A 3.1 – 3.2 g/cm3
Part B 3.0 – 3.2 g/cm3
MIXED VISCOSITY: 110 to 125 Pa·s @ 25°C / 77°F
GLASS TRANSITION
TEMPERATURE (Tg): 39°C / 102°F
HARDNESS, SHORE: >40 D
VOLUME RESISTIVITY: 0.0005 Ω·cm
