Graphene Laboratories, Inc. Flexible Carbon-Filled Electrically Conductive Epoxy G6E-FRP

Description
DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver). A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly and repair and many other similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · Wearable Electronics · Medical Sensors · Fiber-Optics Packaging · Flexible Photovoltaic (Solar) Cell Packaging · Surface Acoustic Wave (SAW) Devices SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth black paste Part B – smooth black paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 2 hours CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F 4 hours @ 80°C / 140°F 2 hours @ 120°C / 248°F DENSITY: Part A 1.0 – 1.2 g/cm3 Part B 1.0 – 1.1 g/cm3 MIXED VISCOSITY: 285 to 295 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 43°C / 109°F HARDNESS, SHORE: >70 A VOLUME RESISTIVITY: ~15 ω·cm
Datasheet
Description
DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver). A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly and repair and many other similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · Wearable Electronics · Medical Sensors · Fiber-Optics Packaging · Flexible Photovoltaic (Solar) Cell Packaging · Surface Acoustic Wave (SAW) Devices SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth black paste Part B – smooth black paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 2 hours CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F 4 hours @ 80°C / 140°F 2 hours @ 120°C / 248°F DENSITY: Part A 1.0 – 1.2 g/cm3 Part B 1.0 – 1.1 g/cm3 MIXED VISCOSITY: 285 to 295 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 43°C / 109°F HARDNESS, SHORE: >70 A VOLUME RESISTIVITY: ~15 ω·cm
Datasheet

Suppliers

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Flexible Carbon-Filled Electrically Conductive Epoxy - G6E-FRP - Graphene Laboratories, Inc.
Ronkonkoma, NY, United States
Flexible Carbon-Filled Electrically Conductive Epoxy
G6E-FRP
Flexible Carbon-Filled Electrically Conductive Epoxy G6E-FRP
DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver). A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly and repair and many other similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · Wearable Electronics · Medical Sensors · Fiber-Optics Packaging · Flexible Photovoltaic (Solar) Cell Packaging · Surface Acoustic Wave (SAW) Devices SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth black paste Part B – smooth black paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 2 hours CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F 4 hours @ 80°C / 140°F 2 hours @ 120°C / 248°F DENSITY: Part A 1.0 – 1.2 g/cm3 Part B 1.0 – 1.1 g/cm3 MIXED VISCOSITY: 285 to 295 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 43°C / 109°F HARDNESS, SHORE: >70 A VOLUME RESISTIVITY: ~15 ω·cm

DESCRIPTION:

G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver).

A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly and repair and many other similar applications.

FEATURES:

· Flexible (after curing)

· Carbon Filled (Non-Metallic & Non-Magnetic)

· Electrically Conductive

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· Wearable Electronics

· Medical Sensors

· Fiber-Optics Packaging

· Flexible Photovoltaic (Solar) Cell Packaging

· Surface Acoustic Wave (SAW) Devices

SPECIFICATIONS:

TWO COMPONENT SYSTEM: Part A – smooth black paste

Part B – smooth black paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 2 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

24 hours @ 25°C / 77°F

4 hours @ 80°C / 140°F

2 hours @ 120°C / 248°F

DENSITY: Part A 1.0 – 1.2 g/cm3

Part B 1.0 – 1.1 g/cm3

MIXED VISCOSITY: 285 to 295 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 43°C / 109°F

HARDNESS, SHORE: >70 A

VOLUME RESISTIVITY: ~15 Ω·cm

Supplier's Site Datasheet

Technical Specifications

  Graphene Laboratories, Inc.
Product Category Industrial Sealants
Product Number G6E-FRP
Product Name Flexible Carbon-Filled Electrically Conductive Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Chemical System Epoxy
Composition Filled
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